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D¨¹NA 800 Sub-Micron Processing System
Coater, Developer, Scrubber, Spin Etcher
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Applications:
¡ñ Sub-Micron ¡ñ Bump ¡ñ Post Passivation ¡ñ Optoelectric ¡ñ Polyimide ¡ñ Solar ¡ñ MEMS
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System Features
- Wafer size range: 100mm - 200mm (fixed for one size)
- Standard footprint: 46¡± x 49¡±
(Dual indexer, single spin module,
and four-module thermal stack system)
- Expandable system configurations
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System Control
- Windows XP
- Graphic user interface with 15 inch
- Touch screen monitor
- Lot operation
- Recipe editor
- Service mode including calibration
- Alarm, event monitoring & history
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 GUI Touch Screen |
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Coater/ Developer
- High performance brushless motor and servo controller
- Spin speed: 0-8000 rpm
- Dispense lines: 3 Max. (1/4OD)
- Programmable moving dispense arm
- Spin chuck material: PCTFE
- Catch cup material: HDPE
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Thermal Stack
- Choose up to four thermal modules per stack
1. HMDS Vapor Prime
2. Hotplate
3. Cool plate
- Block material: Hard anodized aluminum
- Fixed proximity gap: 0.1mm
- Bake module
1. Exaust bake
2. Temperature range: 50-250¡æ
3. Uniformity: 50-150¡æ ¡À 0.3
150-250¡æ ¡À 0.3
- Chill plate module
1. Water cooled
2. Temperature control (optional)
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 Four Thermal Stack |
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Robot
- Dual arms with a creamic vacuum paddle
- X stroke: ¡À 15¡±
- Y stroke: 19¡±
- Z stroke: 18¡±
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Options:
- Wafer cassette mapping sensor
- Full system temperature and humidity control
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