Specifications
# Wafer size: 200mm
#Spin speed range: - 6000 rpm
#Multiple chemical lines (3 max.)
#Motorized dispense arm (optional)
#Pump dispense
#Single arm wafer transfer robot
#System footprint: 23" x 43"
Design specification
1. Coater
, Spin speed: 0 - 6000 rpm
, Dispense lines: 3 Max.
, TEBR
, BEBR
, Solvent bath
, Wafer centering mechanism
2. Robot
, Single arm with a vacuum paddle
, X stroke: +/- 14"
, Z stroke: 8"
3. System control
a) Lot operation
b) Unlimited Recipe and Recipe editor
c) Service mode including calibration
d) Alarm, event monitoring & history
e) Touch screen GUI
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